According to a report by Ars Technica, AMD has quietly stripped a critical security feature from its lower-end CPUs, leaving unaware users potentially vulnerable to physical attacks. Following a months-long investigation tracked on GitHub, Ben Kilpatrick confirmed that the Transparent Secure Memory Encryption (TSME) feature — which protects CPUs against physical exploits that siphon data from connected memory chips — was suddenly no longer available on AMD CPUs outside the company’s Pro lineup.

PC memory manufacturer Team Group has agreed to settle a class action lawsuit to the tune of $1.1 million over allegations it advertised deceptive speeds for its DDR3, DDR4, and DDR5 memory products purchased in the U.S. between May 3, 2020, and April 8, 2026. Similar to a recent case involving G.Skill, the lawsuit claims that consumers were led to believe that the advertised speeds on Team Group’s memory kits could be achieved out of the box without requiring BIOS tweaks or overclocking profiles.

Researchers at Adelaide University have made a discovery that could change the way we test semiconductors for good. As reported by IEEE Spectrum, these researchers have discovered a method of detecting a chip’s transistor activity using terahertz radiation. The process involves using a laboratory tool known as a vector network analyzer or VNA, which generates a microwave signal “with a known frequency and phase.”

As reported by German news outlet ComputerBase, ECS has unveiled its newly revamped Liva P300 mini-PC, specifically engineered to harness the power of Intel’s upcoming Core Ultra 400 (codenamed Nova Lake) processors. These next-generation chips aim to put Intel back in a position to challenge, and potentially surpass, the best CPUs currently available on the market.

Following its well-received family of Strix Halo APUs, AMD will refresh its high-end gaming APU lineup with Gorgon Halo, bringing it up to date with the recently announced Gorgon Point, aka Ryzen AI Max 400, series. The real fun may arrive after that, though, as the true next-gen upgrade will come in the form of “Medusa Halo” sometime in 2027-28.

Samsung was quick to respond this morning when speculators rapidly spread reports of an unprecedented 80% price hike on its entire memory product line. Taiwanese newspaper United Daily News reports that both Samsung and a number of memory module manufacturing partners are claiming that the 80% number is a total fabrication.

As we inch closer to CES 2026 next month, the rumor mill surrounding Intel’s upcoming Arrow Lake refresh churns intensely. Just a few days ago, we covered the Core Ultra 7 270K Plus appearing on Geekbench for the first time, and now that same chip, alongside the rumored flagship Core Ultra 9 290K Plus, has been spotted at a retailer. Obligatory grain-of-salt disclaimer aside, these listings don’t reveal much anyway.

AMD has just revealed an updated Zen roadmap for its CPUs at Financial Analyst Day, labeled “Leadership CPU Core Roadmap.” While it doesn’t delve into details — or even show any new ones — we do get explicit confirmations for a bunch of previously-rumored (albeit obvious) tech. AMD also made Zen 7 official for the first time in a roadmap, teasing a release date beyond 2026. Let’s break it all down.

SOCAMM2 is on track to become the definitive version of the SOCAMM standard very soon. JEDEC has announced that SOCAMM2’s design is nearing completion and will take advantage of the same LPDDR5X memory type as its predecessor. Two upgrades will be added to SOCAMM2: an SPD profile (what most might refer to as a “JEDEC profile”) and improved LPDDR5X transfer rates of up to 9600 MT/s.

It appears that Intel is experiencing a sense of nostalgia, as the chipmaker (via momomo_us) has introduced the Core i5-110 processor, based on Comet Lake. Comet Lake is a stroll down memory lane for many of us, as these 14nm+++ chips were introduced around half a...